Data center cooling
BRONZE AWARD:
Liebert XDH by Emerson Network Power
This unit is designed specifically for data center applications where there is limited overhead space because of overhead cabling or low ceiling height. It fits easily within a row of electronic equipment racks inside a hot-aisle-cold-aisle arrangement and takes advantage of higher heat transfer efficiency by drawing air directly from the hot aisle and moving cool air into the cold aisle.
The Liebert XDH can cool more than 30 kW per rack and features optional flexible piping with quick-connect fittings that allow adaptive and scalable expansion, and re-positioning without interruption of cooling. The Liebert XDH employs a waterless pumped refrigerant technology similar to the rest of its Liebert XD family members.
It delivers cooling with 30% less power than the best traditional cooling systems. The Liebert XDH provides the capability of built-in redundancy to provide the additional reliability when dealing with high-density heat loads. It can be used in conjunction with the existing Liebert XD cooling modules (XDO and XDV) in the same infrastructure arrangement.
The Liebert XD supplements traditional cooling and targets high density areas. This unique cooling, pumping and piping system delivers high-efficiency cooling by allowing the cooling components to be placed close to the source of heat. Because the Liebert XD system provides 100% sensible capacity and removes no moisture from the air, the need for humidification is significantly reduced.
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